International Symposium of EDA 2024 (ISEDA 2024)

★Full Name: International Symposium of EDA 2024 (ISEDA 2024)
★Abbreviation: ISEDA 2024
Date: May 10-13, 2024
Website: https://www.eda2.com/iseda/index.html
Venue: Xi'an, China

EDA2 | ISEDA 2024https://www.eda2.com/iseda/index.html

Jointly organized by EDA2 and EDA Committee of CIE, the ISEDA (International Symposium of EDA) is an annual premier forum dedicated to VLSI design automation. The symposium aims at exploring the new challenges, presenting leading-edge technologies and providing EDA community with opportunities of predicting future directions in EDA research areas. ISEDA covers the full range of EDA topics from device and circuit levels up to system level, from analog to digital designs as well as manufacturing. The format of meeting intends to cultivate productive and novel interchangeable ideas among EDA researcher and developers. Academic and industrial EDA related professionals who are interested in EDA's theoretical and practical research are all welcomed to contribute to ISEDA.

★Advisors:
IEEE/CEDA, ACM/SIGDA
Department of Information Science, National Natural Science Foundation of China (NSFC)
Chinese Institute of Electronics (CIE)
Steering Committee, Major Plan of “Fundamental Research on Post-Moore Novel Devices”

★Organizer:
EDA Ecosystem Development Accelerator (EDA2)
EDA Committee of CIE

★Co-Organizers:
Xidian University
Peking University
Southeast University
Tsinghua University

★Committees:
-Executive Committee-
General Chairs：
Ru Huang，President of Southeast University & Academician of the Chinese Academy of Sciences;
Yue Hao，Professor of Xidian University & Academician of the Chinese Academy of Sciences.

-Steering Committee-
Shaojun Wei, Tsinghua University;
Xuan Zeng, Fudan University;
Patrick Girard, French National Center for Scientific Research.

-Technical Program Committee-
Conference Chairs：
Zhangming Zhu, Xidian University;
Runsheng Wang, Peking University;
Jun Yang, Southeast University.

Technical Program Chairs：
Hailong You, Xidian University;
Yun Liang, Peking University;
Hao Yan, Southeast University.

Special Session Chair:
Wenjian Yu, Tsinghua University.

Industrial Session Chair:
Fan Yang , Shenzhen GWX Technology Co.,Ltd.

Tutorial/Training Chair:
Zuochang Ye, Tsinghua University.

Finance Chair:
Gang Chen, Nanjing Industrial Innovation Center of EDA.

Keynote Speaker Chair:
Wanli Chang, University of York.

Panel Chair:
Yibo Lin, Peking University.

Local Arrangements Chair:
Xiaoning He, Shaanxi Province Semiconductor Association.

Session Chair:
Cheng Zhuo, Zhejiang University.

Publication Chair:
Qiang Xu, The Chinese University of Hong Kong.

Industry Liaison:
Yutao Ma, Primarius Technologies Co.,Ltd.

Exhibition Chair:
Megy Wang, Giga Design Automation Limited.

Publicity Chair:
Xin Li, Duke Kunshan University.

Outreach Chair – US:
Hai Zhou, Northwestern University.

Outreach Chair – Canada;
Peter Chun, University of Alberta.

Outreach Chair – Europe:
Zebo Peng, Link?ping University.

Outreach Chair – Asia;
Xiaoqing Wen, Kyushu Institute of Technology.

★Track Committee:
1. Technology & Model
Chair:
Xingsheng Wang, Huazhong University of Science and Technology.
Co-Chair:
Lining Zhang, Peking University.

2. Analog Circuit EDA
Chair:
Fan Yang, Fudan University.
Co-Chair:
Hao Yu, Southern University of Science and Technology.

3. Digital Design & Verification
Chair: Zhufei Chu, Ningbo University.
Co-Chair: Yong Fu, XEPIC Corporation Limited.

4. Physical Implementation
Chair: Hailong Yao, University of Science and Technology Beijing.
Co-Chair: Peng Cao, Southeast University.

5. Wafer Manufacturing
Chair: Lan Chen, Institute of Microelectronics of The CAS.
Co-Chair: Yayi Wei, Institute of Microelectronics of The CAS.

6. Packaging & Multi-Physics
Chair: Hongliang Lu, Xidian University.
Co-Chair: Min Tang, Shanghai Jiao Tong University.

7.Emerging Technology
Chair: Bei Yu, The Chinese University of Hong Kong.
Co-Chair: Li Jiang, Shanghai Jiao Tong University.

8. EDA Foundation & Standards
Chair: Xiaohui Tan, Nanjing Industrial Innovation Center of EDA.
Co-Chair: Duanduan Jian, China Electronics Standardization Institute.

8. Open Source EDA
Chair: Huawei Li.
Co-chair: Guojie Luo.

8. EDA Contest
Chair: Longxing Shi, Southeast University.
EDA Contest Co-Chair: Zhixiong Di, Southwest Jiaotong University.

★Call for Papers:
Original papers in, but not limited to, the following areas are invited:
[1] Technology & Model
1.1 Device Compact Modeling
1.2 Process Design Kit
1.3 Semiconductor Process & Device Simulation
1.4 Cell Library Design, Characterization and Verification

[2]Analog Circuit EDA
2.1 Schematic & Layout Design
2.2 Circuit Simulation
2.3 On-chip & Packaging Electromagnetic Field Simulation
2.4 Radio-Frequency & Photoelectric Compound Circuit Simulation

[3]Digital Design & Verification
3.1 Digital Simulation / Emulation
3.2 High-Level Synthesis
3.3 Logic Synthesis
3.4 Formal Verification
3.5 Constructing Hardware in Scala Embedded Language

[4]Physical Implementation
4.1 Design-For-Test, Design-For-Reliability, Design-For-Manufacturability
4.2 Placement & Routing
4.3 Parasitic Extraction
4.4 Timing Analysis
4.5 Physical Verification
4.6 Electromigration & IR drop

[5]Wafer Manufacturing
5.1 Computational Lithography
5.2 Masking Manufacturing
5.3 Yield & Defect Analysis
5.4 Process Modeling and Emulation
5.5 Metrology and Silicon Data Processing
5.6 APC (Automatic Process Control) Technology

[6]Packaging & Multi-Physics
6.1 Packaging Design
6.2 Chip Level Thermal Simulation
6.3 Packaging Stress Analysis
6.4 Multi-Physics Simulation

[7]Emerging Technologies
7.1 Artificial Intelligence for EDA
7.2 Cloud / Parallel Computing for EDA
7.3 Heterogeneous Computing for EDA

[8]Miscellaneous
8.1 Open Source EDA
8.2 EDA Database
8.3 EDA Standardization

Authors are invited to submit original papers, which have not been published elsewhere and are not currently under consideration for another journal, conference or workshop. Research findings can be submitted as full papers. All paper submissions must be done electronically using the submission system.

Best Paper Award, Honorable Mention Paper Award will be selected after the presentations.
Invited Talks: Need an abstract within one page
Extended Abstract: 1-2 pages
Regular Paper: 4-6 pages
Note: Extended abstract will not be published. If you have the publication purpose, please submit full paper before the deadline.

★Paper Template
Templates could be downloaded from below or you can find them at the IEEE website: https://www.ieee.org/conferences/publishing/templates.html

★Submission Link: https://www.eda2.com/conferenceHome/submissionHome

★Liaison:
IEEE/CEDA Representative: Tsung-Yi Ho
CIE Representative: Shouyi Yin
Website Chair: Huixin Tang
Secretary: Xiakai Wang

★Contact Us:
Conference Secretary: Ms. Joyce Zhong
Phone: +86 186 2826 3876
Email: iseda@eda2.com
Yu Huang | huangyu61@hisilicon.com

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